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ECEĀ 427. Packaging for Electronics. 3 Credits.

Processes and materials for packaging of electronic components and devices, including integrated circuit chips, chip packages, and board level packaged systems; boards and substrates technology; quality and reliability of electronic packages. Open to all engineering majors. Prereq: Junior standing. S/2 (odd years). Cross-listed with IME 427. {Also offered for graduate credit - see ECE 627.}.